The microstructure of coolingsurface was made up of large numbers of iron particles with several micron diameter and copper base.
数量众多的直径约为几微米的铁粒子和铜基体组成了冷却表面的微观组织。
2
The coolingsurface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels.
冷却界面可结合 至电子元件如芯片上，冷却介质供给到通道组中的至少一组。
3
It shows that reasonable use of artificial roughness on the coolingsurface of the mould can enhance the cooling of the mould and increase productivity.