英语词汇dicing saw怎么读，是什么意思，单词翻译、读音、固定搭配用法和短语词组及例句-英汉双解词典

单词

dicing saw

释义

dicing saw

美/ ?da?s?? s?? /

简明释义

切片锯：一种使用高速主轴配备极薄的金刚石刀片或金刚线来切割、切割或切割半导体晶片、玻璃、陶瓷、水晶和许多其他类型材料的锯。

网络释义

1
?切割锯
... dichotomy 对分 dicing saw 切割锯 dicing 切割 ...
2
?划片机
... dichroscope 二色镜 dicing saw 划片机 dicinnamlalcetone 二苯基壬四烯酮 ...
3
?切割机
精密加工设备&&& 切割机(Dicing Saw), 切断机(Cutting Saw) Specification Comparison Chart 激光切割机(Laser Saw) 研削机(Grinder) 抛光机(Polisher), 干式蚀刻机(...
4
?芯片切割
从上胶膜(Tap er)、芯片研磨(Grinder)、装配(Mounter)以至于芯片切割(Dicing Saw)等步骤，都需进行机台的调整以配合300mm晶圆的加大尺寸。

短语

1
wafer dicing saw
切片锯 ; 转让划片机
2
substrate dicing saw
衬底切割锯
3
dicing saw network management
切割锯刀网路管理 ; 切割

双语例句

1
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
2
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
主要阐述了HP - 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。

同近义词

切割机，切割锯；钻石轮划片机
cutter bar??/??cutting machine

随便看

英汉双解词典包含3185865条英汉词条，基本涵盖了全部常用单词的翻译及用法，是英语学习的有利工具。

单词	dicing saw
释义	dicing saw 美/ ?da?s?? s?? / 简明释义切片锯：一种使用高速主轴配备极薄的金刚石刀片或金刚线来切割、切割或切割半导体晶片、玻璃、陶瓷、水晶和许多其他类型材料的锯。网络释义 1 ?切割锯 ... dichotomy 对分 dicing saw 切割锯 dicing 切割 ... 2 ?划片机 ... dichroscope 二色镜 dicing saw 划片机 dicinnamlalcetone 二苯基壬四烯酮 ... 3 ?切割机精密加工设备&&& 切割机(Dicing Saw), 切断机(Cutting Saw) Specification Comparison Chart 激光切割机(Laser Saw) 研削机(Grinder) 抛光机(Polisher), 干式蚀刻机(... 4 ?芯片切割从上胶膜(Tap er)、芯片研磨(Grinder)、装配(Mounter)以至于芯片切割(Dicing Saw)等步骤，都需进行机台的调整以配合300mm晶圆的加大尺寸。短语 1 wafer dicing saw 切片锯 ; 转让划片机 2 substrate dicing saw 衬底切割锯 3 dicing saw network management 切割锯刀网路管理 ; 切割双语例句 1 The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed. 从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术； 2 The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment. 主要阐述了HP - 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。同近义词切割机，切割锯；钻石轮划片机 cutter bar??/??cutting machine
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