The biggest difficulty is chemical depositionofcopper of PTFE activation pretreatment, is also the most crucial step.
其最大的难点是化学沉铜前的聚四氟乙烯活化前处理，也是最为关键的一步。
2
This study developed a view factor model to simulate the physical vapor depositionofcopper interconnect in low pressure conditions using cylindrical targets.
研究开发了一个角系数模型来模拟低气压下圆柱靶溅射沉积铜连线。
3
The results showed the reaction ofcopperdeposition was irreversible.