This system can be also used for the automatic control of the electro plating and aluminum anodizing process and the DC characteristic measurement of some semiconductor transistor.
同时此系统也可以用于电镀，铝阳极氧化等电化学过程控制，以及晶体管直流特性测试等方面。
2
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
3
Adopting pulse electroplating can obtain more excellent performance of the plating layer than the traditional DC electroplating.