The influence of anode current density, polishing temperature, polishing time and stirring modes on polishing quality was discussed.
探讨了阳极电流密度、抛光温度、抛光时间和搅拌方式对抛光质量的影响。
2
Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.