The polyimide monomer of 3,3 -dimethyl-4,4 -diaminodiphenylmethane(MDT)was synthesized through the reaction between O-methyl aniline and aqueous formaldehyde solution.
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.