With the Dopplerlaser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
2
The horizontal velocity at the outermost edge and thickness of bubbly flow are measured by laserDoppler velocity technique.
利用激光测速技术测量了平板水平放置时气泡流最外缘处的水平速度及厚度。
3
A new type of rotation body profile measuring system utilizing laserDoppler effect was proposed.