It can solve the problems such as inhomogeneous heating of different solder bumps in ballgridarray, simultaneous heating of chip and carrier with solder ball, etc.
In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ballgridarray package that is popular in modern electronic industry.
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ballgridarray (PBGA) component.