The results show that valve-sieve compound trays have smaller turndown ratio and smaller capacity.
试验结果表明：浮阀筛孔复合塔板操作弹性小、气液处理量小；
2
Double hole diameters compound trays have a little larger capacity in comparison of single hole diameter compound trays and their turndown ratio is over 3.5.
双孔径复合塔板比单孔径复合塔板处理量略微增大，操作弹性高达3.5以上。
3
All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.