The metal foil chipresistance would be finished after taking the final process.
接着，进行其它后续步骤以完成金属箔芯片电阻器的制作。
2
Incomplete cure can result in poor chipresistance for subsequent coatings and film distortions which cause poor appearance.
不完全的固化会导致涂层的耐冲击性能不佳，漆膜变形引起的外观不良等。
3
As a digital programmable chip of signal conditioning chip, PGA309 is mainly used in resistance bridge pressure sensors, it amplifies and outputs the weak signal from the sensor.