Germanium could be the next great chipmaterial after silicon's limits have been reached.
在硅的容量达到极限后，锗有望成为下一个伟大的芯片材料。
2
The process parameters, characteristic and the quality requirement on chipmaterial of different parts in the production equipment are described in detail.
详述本生产装置各部位的工艺参数、特点及原料切片的质量要求。
3
This paper introduces a fabricated method of using fused silica as the chipmaterial. It includes standard photolithography, wet chemical etching and bonding techniques.