With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
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Moreover, some major processes package of MEMS, including wafer-levelpackaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.