It proves that the designed parallel bonding mechanism meets the working requirements of IC ChipDie by these characteristic curves.
根据这些曲线,说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
2
More important than the CPU cores, however, is the fact that half the chipdie is now taken up by the graphics-processing circuitry.
然而,比CPU核心,更重要的是一半的芯片模具现在采取的图形处理电路。
3
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC ChipDie.