The heat sink is in thermal contact with the integrated circuitpackage to extract heat during operation.
散热片与集成电路封装热接触用于在工作过程中提取热量。
2
The invention involves the integrated circuitpackage domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.
本发明涉集成电路封装领域，具体地说，涉及对管脚电镀时，防止置换反应的方法。
3
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.