Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
In the wedding before two weeks of stopping the use of nail polish and avoid exposure to chemical detergent, let your nails with a finishing period.
在婚礼的前两周停止使用指甲油并尽量避免接触化学洗涤剂，让你的指甲有一个修整期。
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Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.