The shape, distribution and density of etch pits on the (101) face was observed by metalloscope after chemical etching.
单晶,通过化学腐蚀和金相显微镜研究了(101)晶面蚀坑的形貌、分布特征及其密度的大小。
2
The invention also discloses a chemical etching agent matched with the compound to take deep etch to glass, silicon water and metal material.
本发明还公布了与光成像组合物配合使用,对玻璃,硅晶片、金属基材等进行深度刻蚀的化学刻蚀剂。
3
Constancy of chemicaletch rate method was modified so as to reduce the influencing factors such as temperature and concentration of HF acid. The efficiency and accuracy are improved.