The gas outlet holes (74, 75) and gas channels (70, 80) are configured to support a wafer using the Bernoulliprinciple.
气体出口孔(74,75)和气体通道(70,80)被配置以便利用伯努利定理支撑晶片。
2
The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulliprinciple.