The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
This paper describes the characteristic and fabrication technology of COF(Chip on Film)tape for large-scale LCD(Liquid Crystal Display), and fine pitch wiring formation technology.
概述了大型液晶显示用COF带的特征和制造技术以及细节距线路形成技术。
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In this paper, the structure, features, key process, applications and developing direction of COF are summarized.