Wetchemicaletching of sacrificial layers plays an important part in fabricating movable tree-dimensional micromachines by combination with MEMS technologies.
牺牲层腐蚀技术结合MEMS技术是制作三维可动微机构的一个重要加工手段。
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This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wetchemicaletching and bonding techniques.