The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
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A method of forming a chopped strand mat formed of bonding materials and wet use chopped strand glass fibers (WUCS) which demonstrate a reduced occurrence of static electricity is provided.
This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.