In this work, copper underpotential deposition on gold is studied under realistic electrochemical conditions
本文研究了在实际电化学条件下铜在金表面的低电位沉积
2
Thin-layer electrochemical studies of the underpotential deposition(UPD) of Bi and Te on cold rolled silver substrate have been performed.
研究了冷压银衬底上铋和碲的欠电位沉积薄层电化学行为。
3
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.