The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
2
Shear displacement transfer characterised via separate analysis of side friction and tip resistance, and then associating them through displacement coordination.
剪切位移传递法的主要特点是将桩侧摩阻力与端阻力分开考虑，通过位移协调将二者再联系起来。
3
Sample A whose surface has layer structure via oxidize-deoxidize treatment and sample B which is decarbonization are put into resistance furnace for carbonization and quencher under hydrogen.