Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafertopography.
化学机械抛光(CMP)在半导体工业内获得了广泛的赞同,对控制形貌起伏的硅片表面当作首选方法。
2
In this paper, the principle of electron beam write wafer is discussed briefly distinguish topography mark, and make the technology of wafer mark which is found by the electron beam exposure system.