Average waferthickness value on basis of 100% control with an automatic inspection system.
晶片的平均厚度值以100%控制的自动检测系统的测量值为基础。
2
It is possible to get 29% efficiency by reducing waferthickness and employing light trapping technology.
采用减薄硅片衬底厚度和光陷阱技术可望使转换效率达到29%。
3
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energy of adhesion, the material deformability and the silicon waferthickness.