This paper presents a new solution of minority carrier continuity equation for a wafer with different surface recombination velocity on its two surfaces.
本文给出了有相异表面复合速度时半导体薄片少子连续方程的一种新解法。
2
The paper presented a novel way to fabricate silicon microneedles with (110) si-wafer.
描述了一种用（110）晶面硅片制造微米针管的新方法。
3
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.