The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
其方法是往硅片上涂上一层二氧化硅防护膜。
2
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
3
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.