The company said that three - and four-inch material accounted for 70 percent of the GaAs wafer output in 2007 and the market for larger diameter material will continue through 2012.
With the application of larger diameter silicon wafer, high precision grinding is widely used for its manufacturing.
随着大直径硅片的应用，硅片的超精密磨削得到广泛的应用。
3
With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.