Direct wafer makes individual wafers straight from molten silicon-no cutting required.
直接硅片技术能直接在熔融晶中制成单片晶圆，不需要切割。
2
Cutting groove grids on wafer surface in a special size and shape depends upon the costumers needs.
按客户要求的规格和形状在硅片表面切割出具有一定深度的沟槽。
3
To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.