Chemical passivation: will contain antioxidant parts in solution in processing, make the surface to form a thinfilm of the state of the process. Blunt.
化学钝化：将制件放在含有氧化剂的溶液中处理，使表面形成一层很薄的钝态保护膜的过程。
2
Through the selection of processing parameters and surface modification. The distribution of thinfilm stress is possible changed and thin film property is improved.
通过选择适当的工艺条件以及表面处理可以改变薄膜的应力分布，提高薄膜的性能。
3
A new technique for fabricating EMIF in thinfilm IC based on superfine processing technique is proposed.