For fabrication, a thinfilmprocess of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
2
Weak erosion before plating, in a certain: remove metal parts in the solution of surface extremely thin oxidation film, and make the process of surface activation.
弱浸蚀：电镀前，在一定组成溶液中除去金属制件表面极薄的氧化膜，并使表面活化的过程。
3
A team led by physical chemist Mircea Cotlet created a transparent thinfilm using a relatively simple process.