For fabrication, a thinfilm process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
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Abstract: Molybdenum alloy thinfilm is the key material in the information storage, integrated circuit chip, especially flat panel display, thinfilm solar cell and sapphire manufacture.
The flux transformer and DC-SQUID were fabricated on same thinfilm substrate, avoiding the difficulty of single chip coupling alignment between flux transformer and DC-SQUID.