This pa-per introduces thickfilm assembling technique, equipment, technical parameters and testing methods while narrating the manufacturing process of thickfilm circuits.
在叙述点火模块厚膜电路的生产过程中系统介绍了厚膜封装工艺、相关设备、技术参数和检测方法。
2
Chapters 3 concentrate on the feature of thickfilm high frequency module and the high frequency function of the SPE technique.
第三章重点阐述厚膜高频集成器件的特性和SPE技术及其高频性能。
3
A novel technique of laser micro-cladding is used to flexibly and directly fabricate thick-film resistors on ceramic substrate.