This pa-per introduces thickfilm assembling technique, equipment, technical parameters and testing methods while narrating the manufacturing process of thickfilm circuits.
在叙述点火模块厚膜电路的生产过程中系统介绍了厚膜封装工艺、相关设备、技术参数和检测方法。
2
Thickfilm material and process applied in microwave and RF circuits are offered in the paper.
介绍了应用于微波和RF电路中的厚膜材料和工艺。
3
PRIMARY FUNCTION OF POSITION: Responsible for the product modification and localization of thickfilm materials, formula and process developing.