A survey to make high density multilayerthickfilm surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
2
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thickfilm printing technology.