Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-filmcircuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
2
The power lever and thickfilm driving circuit of traditional inverter were replaced by IPM to evloution inverter. Some problems in using IPM are proposed and solved.
使用IPM代替传统变频器的功率级和厚膜驱动电路改造变频器，提出了使用智能功率模块应注意的几个问题。
3
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thickfilm printing technology.