And then, based on experiments and combined with three-dimensional full-wave electromagnetic simulation software, the frequency domain and time domain performance of the through-holevia is analyzed.
然后基于实验研究，并结合三维全波电磁仿真软件在频域和时域对通孔结构性能进行分析。
2
Removed from the circuit board through-hole components via multi pin component and the large heat capacity is quite troublesome, such as transformer, connector.
从电路板上拆除多引脚的通孔元件和大热容量的通孔元件比较麻烦，比如变压器、接插件。
3
A viahole is formed in the substrate within the spirally patterned conductor layer, the viahole being formed by through silicon via (TSV).