This paper introduced a copper plating process for micro-via filling and throughholeplating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
2
A process for throughholeplating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
The technology of the platingthroughhole of the printed circuit board was briefly introduced the platingthroughhole technology of the microwave printed circuit board were also illuminated.