No substrate deformation and collapse, no strength reduction and cracks after welding.
无基材结构变形的影响，无变形及塌陷，焊接后强度减小和龟裂。
2
Compared with other conductive metal layer, copper coating with small with stress, high mechanical strength, the plastics substrate and coating binding force is good wait for a characteristic.
与其它导电金属层相比，镀铜层具有应力小、机械强度高、塑料基体与镀层结合力好等特点。
3
The portion of the powder formulation that forms the primary strength of the film. It binds pigments and additives into a solid film and to the substrate.