Preferably, the burner is used to initiate the thermalstresscrack, by increasing the power supplied to the glass.
优选地，利用燃烧器，通过增加供给给玻璃的能量，来启动热应力裂纹。
2
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermalstress and strain in solder reflow are the main causes of heel crack.
The complex function method is used to solve the temperature field and thermalstress field around the crack tip at the moment when the pulse current is switched on.