An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
2
The outer peripheral face of the sleeve is fixed at the upper end of the case 6 by filling an adhesive in an adhesive reservoir formed between the sleeve 5 and the case 6.
In the course of operation, three edge teeth and the lateral wall face of a claw opening are adhesive and apply force with workpieces. Then, the workpieces can be effectively clamped.