Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.
微胶接技术非常适用于微机电系统产品的自动化装配过程。
2
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
3
Such adhesive strips, especially adhesive strips for assembly, which are used to permanently fix objects to substrates, are preferably designed in a multi-layer manner.