LED chip and heat sink for thermalconnection to solve the thermal grease, thermal paste difficult operation, uneven coating, plastic overflow problem caused by defective products.
用于LED芯片和散热器导热连接，解决了散热膏，导热膏难操作，涂不均匀，溢胶造成不良品的难题。
2
The model of thermal expand valve is built and the connection of flux, pressure difference between the front and behind of the valve and cryogen dryness of inlet and outlet.
建立了热力膨胀阀模型，重点建立了流量与阀前后压差及制冷剂进出口干度的关系。
3
To reduce thermal EMF in measurement circuit, the techniques of connection among cables by special press and temperature-controlled box are studied.