Northrop Grumman is responsible for systems engineering, system integration, the beam control subsystem, the power subsystem, the thermal subsystem and C3I.
诺斯罗普·格鲁曼公司负责系统工程、系统集成、光束控制子系统、电源子系统、热子系统以及C3I。
2
Shape memory alloy wires can increase the critical temperature of the beam, and also can restrain thermal buckling occurring or make the post-buckled beam back to initial equilibrium states.
This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.