A flexible tapesubstrate for a semiconductor die to be mounted on an area thereof has a two-dimensional array of apertures formed therein around at least one side of the area.
The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed.
对目前已研究和使用过的低介电常数和低烧结温度基板材料及综合性能，流延浆料有机添加剂进行了对比分析。
3
This system applies tape to both sides of a substrate and cuts the tape closely to the edges of the substrate.