Figure 7 shows the sequence for tapebonding the chip and assembling the package.
图7所示为带状引线连接芯片和管壳装配的工艺程序。
2
Measure, cut and install carpeting using hand or machine stitcher, seaming iron, bondingtape or other bonding materials.
使用手工或机器装订机，接缝熨斗，粘结胶带或其他粘接材料测量，切割和安装地毯。
3
The results show that there have higher peel strength between adhesive tape and polyester or polyamide. It is applicable for bonding the end of zipper cloth base.