This paper puts forward an online measuring method for measuring the stress in silicon samples prepared with three common micromachining processes: deposition, etching, and bonding.
Then the profile of etching front is studied and the forming factors of the triangle at etching front are analyzed. The results show that the major factor of the triangle formation is stress.
提出了应力是产生腐蚀前端三角形的主要原因的推测,并通过退火实验验证了这一推测。
3
The chemical etching was an effective way for relieving of machining residual stress.