The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surfacemounttechnology (SMT).
随着微电子表面组装技术的迅猛发展,软钎料尤其是无铅钎料逐渐成为研究的焦点。
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SurfaceMounttechnology is extensively applied in the assembly of electronic components and PCBs. The article illustrates some of the concerns in SMT processing technology on PCB designs.
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surfacemounttechnology (SMT) product line.