Standard surface-mounttechnology or through-hole techniques provide adequate performance.
标准表面贴装技术或通孔技术提供足够的性能。
2
A survey to make high density multilayer thick film surfacemount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
3
SurfaceMounttechnology is extensively applied in the assembly of electronic components and PCBs. The article illustrates some of the concerns in SMT processing technology on PCB designs.