The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surfacemount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
2
In surfacemount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
3
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surfacemount process for the solder joint quality control was presented.