...点可靠性的影响 l 金属渗析 l 热损伤 l 空洞对焊点可靠性的影响 6．PCBA使用过程中的工艺可靠性问题与解决 l 锡须（Tin Whisker） l Kirkendall空洞 l 导电阳极丝(CAF):典型案例讲解 l 电迁移 l 助焊剂残留造成的腐蚀失效 l 特殊工作环境对工艺可靠性的要求:典...
However, it suffers from some problems such as tinwhisker, surface color changes and bath mudding.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
2
When adding stress with ambient temperature storage, the formation of tinwhisker was completely inhibited.
当施加恒定外应力后进行室温处理，锡须的形成完全受到抑制。
3
However, it is generally thought that the market demand for environmentally friendly components will eventually outweigh the potential for tinwhisker component failure.